Project/Item | Processing Capacity | |
Layers | 1-48Layers | |
Max Machining/Production Size | 630x730mm | |
Product Board Thickness | 0.3-6mm | |
Copper foil thickness of conductor | 1/3-120Z | |
Min Line Width/Space | 0.075/0.075mm（3mil/3mil）- | |
Min Aperture | 0.15mm（6mil） | |
Through hole single side welding ring | 0.1mm（4mil） | |
Impedance Control | ±5% | |
Profile Machining Accuracy | ±0.01mm（4mil） | |
Board Type/available laminates materail | CEM-3、FR4 （High Tg，Halogen Free） ,Rogers,Teflon,Arlon, Metal Base(Aluminum,Copper), Mixematerial | |
Surface Treatment | HASL、Nickel gold plating、ENIG、Immersion Silver、Immersion Tin、OSP、Immersion gold +OSP、Nickel gold plating + HASL | |
Other | Manufacturing capacity of Shenzhen factory：2-16Layers、Thick copper plate、Copper thickness 1-9OZ、Plate thickness 0.6-5.0mm | |
Capacity | 2.48 million square feet / month 2L-20%、4L-40%、6L and above40% | |
Sample | Double side 3-4Days；Multilayer 6-7days | |
Staus/time/product | Double side | Multilayer |
New order | 7-8days | 9-12days |
Repeat order | 6-7days | 8-12days |
Factory
